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Future Of High-Performance Computing: Refactoring Data Centers For Power & Network Densities

April 26, 2023
Discover the challenges of redesigning data centers for high power & network densities. Explore alternative cooling tech for HPC, AI & next-gen chip architectures from NVIDIA, INTEL, AMD, and ARM.
The demands of supercomputing, large-scale AI systems, and next-generation chip architectures from NVIDIA, INTEL, AMD, and ARM have created a need to refactor data center design for ultra-high power and network densities. As data center power densities continue to rise, traditional air cooling is becoming less effective, and alternative cooling technologies are becoming more important. This article explores the challenges of redesigning existing low-density data centers and the use of alternate cooling technologies to support high-performance computing. This content is sponsored by: