Solving the AI Cooling Challenge: Lessons from the Front Lines of Data Center Cooling

As AI, HPC, and accelerated workloads push power densities to new heights, legacy cooling strategies are reaching their limits.
Sept. 5, 2025

Solving the AI Cooling Challenge explores how data center operators can evolve their infrastructure to meet modern thermal demands—starting at the cabinet level. Backed by CPI’s decades of experience in airflow management and direct-to-chip liquid cooling, this paper delivers practical insights into hybrid cooling design, the science behind passive and active containment, and the role of cabinets as engineered thermal platforms.

Learn how to:

  • Identify the tipping point from air to liquid cooling
  • Integrate containment, power, and monitoring into a unified system
  • Support densities of 100 kW+ without major room redesigns
  • Improve sustainability and reduce energy and water use
  • Avoid common pitfalls with real-world deployment lessons

Whether you're planning a retrofit or designing for next-gen compute, this guide helps you build smarter from the inside out.