ASK THE EXPERT: AI is Reshaping Liquid Cooling from the Valve Up

Aug. 24, 2026

AI has accelerated nearly every aspect of data center design. New processors demand dramatically higher cooling performance, construction schedules continue to compress, and cooling technologies are evolving almost as quickly as the chips themselves. That pace is creating a new challenge beyond servers and infrastructure: the industrial components that support liquid cooling must evolve just as rapidly.

According to Eddie Burns, market manager at U.S. Valve, the industry’s biggest challenge isn’t simply moving more coolant. It’s developing smarter, more efficient components on timelines measured in months instead of years. As hyperscalers push for greater density and faster deployments, success depends on engineering agility, customized designs, and supply chains that can scale as quickly as demand.

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