Global demand for data center capacity is expected to grow between 19 and 22 percent annually through 2030, according to McKinsey & Company. As data center capacity expands, so does the challenge of managing the heat generated by high-performance chips. This includes heat at the chip, as well as external heat rejection and room cooling. LG, a global HVAC technology leader, discusses the evolving landscape and the latest technology to ensure efficient, reliable cooling for data centers. This includes the full suite of data center cooling solutions that LG debuted at Data Center World 2025. The cutting-edge cooling technologies, including direct-to-chip, room, and chiller plant cooling capabilities, are intended to meet the challenge of increasing data center capacity head-on helping provide reliable, energy-efficient solutions.